Inkampani yaseNingbo Deamakyinkampani ejongene noyilo kunye nokuveliswa kwezibane zasebusuku ezikrelekrele. Itekhnoloji yomthombo wokukhanya weCOB isetyenziswa kwezinye iimveliso zenkampani.
Umthombo wokukhanya we-COB ngumthombo wokukhanya odibeneyo wamandla aphezulu. Kukukhanya okuphezulu okusebenzayo okudityanisiweyo komthombo wetekhnoloji yomthombo wokukhanya oncamathela ngokuthe ngqo I-chip ye-LED kwisibuko sesinyithi esinexabiso eliphezulu. Le teknoloji iphelisa ingcamango ye-bracket kwaye ayinayo i-electroplating, i-reflow welding kunye nenkqubo ye-SMT, ngoko ke inkqubo iyancitshiswa malunga nesinye kwisithathu kwaye iindleko nazo zigcinwa ngesinye kwisithathu.
Umthombo wokukhanya we-COB unokuyilwa ngokwesakhiwo semilo yemveliso yendawo yokukhanya yomthombo wokukhanya kunye nobukhulu.
Iimpawu zemveliso: zitshiphu, zilungele
Uzinzo lombane, uyilo lwesekethe, uyilo lwe-optical, uyilo lokutshatyalaliswa kobushushu besayensi kunye nengqiqo;
Itekhnoloji ye-Heat sink yamkelwa ukuqinisekisa ukuba i-LED inezinga lokugcinwa kwe-lumen ekhokelayo kwishishini (95%).
Kukulungele ukudibanisa i-optical yesibini yemveliso kunye nokuphucula umgangatho wokukhanyisa.
Umboniso wombala ophezulu, i-luminescence efanayo, akukho ndawo yokukhanya, impilo kunye nokukhuselwa kwendalo.
Ukufakela okulula, kulula ukuyisebenzisa, ukunciphisa ubunzima bokuyila isibane, ukugcina ukulungiswa kwesibane kunye neendleko zokugcinwa okulandelayo.
Kukho iindlela ezimbini eziphambili zetekhnoloji yeChip engenanto: itekhnoloji yeCOB kunye neteknoloji yeFlip Chip. I-Chip kwi-board packaging (COB), i-semiconductor chip handover efakwe kwibhodi yesekethe eprintiweyo, i-chip kunye ne-substrate uxhumano lombane lwenziwa ngendlela ye-lead suture, kwaye ihlanganiswe ne-resin ukuqinisekisa ukuthembeka.
Inkqubo ye-Chip On Board (COB) kukugquma indawo yokubeka i-silicon wafer nge-thermal conductive epoxy resin (ngokubanzi isilivere edope epoxy resin) Kumphezulu we-substrate, kwaye emva koko ubeke i-silicon wafer ngqo kumphezulu we-substrate. unyango lobushushu de i-silicon wafer iqiniswe ngokuqinileyo Kwi-substrate. Emva koko i-welding yocingo isetyenziselwa ukuseka uqhagamshelo lombane oluthe ngqo phakathi kwe-silicon wafer kunye ne-substrate.
Ukuba ufuna ukwazi ngakumbi malunga neemveliso zethu, nceda undwendwele iwebhusayithi yethu esemthethweni:www.deamak.com
Ixesha lokuposa: May-04-2022