Ningbo Deamak Companywaa shirkad ku takhasustay naqshadeynta iyo soo saarista nalalka habeenkii ee caqliga leh. Tignoolajiyada isha iftiinka ee COB ayaa loo adeegsadaa alaabada shirkadda qaarkood.
Isha iftiinka COB waa il iftiin korka isku dhafan oo awood sare leh. Waa hufnaan sare oo iftiin leh oo isku dhafan tignoolajiyada isha iftiinka dusha oo si toos ah ugu dhejisa chip LED-ka substrate birta muraayadda oo leh heer sare oo milicsi. Tiknoolajiyadani waxay meesha ka saaraysaa fikradda bracket-ka oo aan lahayn koronto-samaynta, alxanka dib-u-socodka iyo habka SMT, markaa habka ayaa la dhimay ku dhawaad saddex-meelood meel, kharashka sidoo kale waxaa lagu badbaadiyay saddex-meelood meel.
Isha iftiinka COB waxaa loo qaabayn karaa iyadoo loo eegayo qaabka qaabka sheyga ee meesha iftiinka iftiinka iyo cabbirka.
Tilmaamaha badeecada: jaban, ku habboon
Xasiloonida korantada, naqshadaynta wareegga, naqshadaynta indhaha, naqshadaynta kuleylka kuleylka sayniska iyo macquulka ah;
Tiknoolajiyada heerkulbeegga kuleylka waxaa loo qaatay si loo hubiyo in LED-ku leeyahay heerka haynta iftiinka kuleylka ee hogaaminaya warshadaha (95%).
Waxay ku habboon tahay is-waafajinta indhaha labaad ee alaabta waxayna hagaajinaysaa tayada iftiinka.
Muqaal midabkiisu sarreeyo, iftiin isku mid ah, meel iftiin ah oo aan lahayn, caafimaadka iyo ilaalinta deegaanka.
Rakibaadda fudud, fududahay in la isticmaalo, yareyso dhibka naqshadeynta laambada, badbaadinta farsamaynta laambada iyo kharashyada dayactirka ee xiga.
Waxaa jira laba nooc oo waaweyn oo tignoolajiyada Chip qaawan: tignoolajiyada COB iyo tignoolajiyada Flip Chip. Chip on board packaging (COB), gacan-ku-wareejinta semiconductor-ka ee ku dheggan looxa wareegga PRINTED, chip iyo substrate ku xidhidhiyaha korantada waxaa lagu xaqiiqsaday habka tolmada rasaasta, oo lagu daboolay resin si loo hubiyo isku halaynta.
Habka Chip On Board (COB) waa in lagu daboolo meelaynta wafer silikoon leh resin epoxy kuleyl ah (guud ahaan qalinka doped epoxy resin) Dusha sare ee substrate-ka, ka dibna si toos ah u dhig wafer silikoon dusha sare ee substrate-ka, daawaynta kulaylka ilaa maraqa silikoon ay si adag u go'an tahay Substrate-ka. Kadib alxanka siliga waxaa loo isticmaalaa in lagu sameeyo xiriir koronto oo toos ah oo u dhexeeya wafer silikoon iyo substrate-ka.
Haddii aad rabto inaad wax badan ka ogaato alaabtayada, fadlan booqo boggayaga rasmiga ah:www.deamak.com
Waqtiga boostada: May-04-2022