Iyo kambani Ningbo Deamakikambani inoshanda mukugadzira nekugadzira mwenje wehusiku wakangwara. COB light source tekinoroji inoshandiswa mune zvimwe zvigadzirwa zvekambani.
COB light source isimba repamusoro rakasanganiswa pamusoro pechiedza sosi. Iyo yakakwira mwenje inoshanda yakasanganiswa pamusoro pechiedza sosi tekinoroji inonamira zvakananga THE LED chip pagirazi simbi substrate ine yakakwirira inoratidzira mwero. Iyi tekinoroji inobvisa pfungwa yebhuraketi uye haina electroplating, reflow welding uye SMT process, saka maitiro anoderedzwa neinenge chikamu chimwe chete muzvitatu uye mutengo unochengetwawo nechikamu chimwe chete muzvitatu.
COB mwenje sosi inogona kugadzirwa zvinoenderana nechigadzirwa chimiro chimiro chemwenje sosi mwenje nzvimbo uye saizi.
Zvigadzirwa zvechigadzirwa: zvakachipa, zviri nyore
Magetsi kugadzikana, redunhu dhizaini, optical dhizaini, kupisa kupisa dhizaini yesainzi uye inonzwisisika;
Tekinoroji yekupisa yekupisa inogamuchirwa kuti ive nechokwadi chekuti LED ine indasitiri inotungamira thermal lumen retention rate (95%).
Iyo yakanakira iyo yechipiri optical matching yechigadzirwa uye inovandudza kunaka kwemwenje.
High color kuratidza, yunifomu luminescence, hapana chiedza chivara, hutano uye kuchengetedza kwezvakatipoteredza.
Kuisa nyore, nyore kushandisa, kuderedza kuoma kwekugadzira mwenje, kuchengetedza mwenje kugadzirisa uye inotevera mari yekugadzirisa.
Kune maviri makuru mafomu eakashama Chip tekinoroji: COB tekinoroji uye Flip Chip tekinoroji. Chip pabhodhi packaging (COB), semiconductor chip handover yakanamirwa kune PRINTED redunhu bhodhi, chip uye substrate yemagetsi yekubatanidza inoitwa ne lead suture nzira, uye yakafukidzwa neresin kuve nechokwadi chekuvimbika.
Maitiro eChip On Board (COB) ndeyekuvhara iyo silicon wafer yekuisa poindi ine thermally conductive epoxy resin (kazhinji sirivha doped epoxy resin) Pamusoro peiyo substrate, wobva waisa silicon wafer zvakananga Pamusoro peiyo substrate, kupisa kurapwa kusvikira silicon wafer yakanyatsogadziriswa Pa substrate. Ipapo waya welding inoshandiswa kumisikidza yakananga magetsi kubatana pakati pesilicon wafer uye substrate.
Kana iwe uchida kuziva zvakawanda nezve zvigadzirwa zvedu, ndapota shanyira yedu yepamutemo webhusaiti:www.deamak.com
Nguva yekutumira: May-04-2022