ʻenehana kumu kukui COB

ʻO ka Hui Ningbo DeamakHe hui kūikawā i ka hoʻolālā a me ka hana ʻana i nā kukui pō akamai. Hoʻohana ʻia ka ʻenehana kumu kukui COB i kekahi mau huahana o ka hui.

ʻO ke kumu kukui COB kahi kumu kukui hoʻohui mana kiʻekiʻe. ʻO ia kahi ʻenehana kumu kukui hoʻohui kiʻekiʻe e hoʻopili pololei ana i ka chip LED ma ke aniani metala substrate me ka nui o ka noʻonoʻo kiʻekiʻe. Hoʻopau kēia ʻenehana i ka manaʻo o ka bracket a ʻaʻohe electroplating, reflow welding a me ka kaʻina SMT, no laila ua hoʻemi ʻia ke kaʻina hana ma kahi kokoke i hoʻokahi hapakolu a mālama ʻia ke kumukūʻai e ka hapakolu.

Hiki ke hoʻolālā ʻia ke kumu kukui COB e like me ke ʻano o ke ʻano huahana o ka wahi māmā kumu kukui a me ka nui.

Nā hiʻohiʻona huahana: cheap, maʻalahi

ʻO ke kūpaʻa uila, ka hoʻolālā kaapuni, ka hoʻolālā optical, ka hoʻolālā hoʻoheheʻe wela i ka ʻepekema a kūpono;

Hoʻohana ʻia ka ʻenehana wela e hōʻoia e loaʻa i ka LED ka nui o ka mālama ʻana o ka lumen wela (95%).

He mea maʻalahi no ka hoʻohālikelike optical lua o ka huahana a hoʻomaikaʻi i ka maikaʻi o ke kukui.

Hōʻike kala kiʻekiʻe, luminescence like ʻole, ʻaʻohe wahi kukui, ke olakino a me ka pale ʻana i ke kaiapuni.

Hoʻokomo maʻalahi, maʻalahi e hoʻohana, hoʻemi i ka paʻakikī o ka hoʻolālā kukui, mālama i ka hana kukui a me nā kumukūʻai mālama ma hope.

 

ʻElua mau ʻano nui o ka ʻenehana Chip ʻole: ʻenehana COB a me ka ʻenehana Flip Chip. Chip on board packaging (COB), semiconductor chip handover i hoʻopili ʻia i ka PRINTED circuit board, chip and substrate electrical connection is realized by lead suture method, a uhi ʻia me ka resin e hōʻoia i ka hilinaʻi.

 

ʻO ke kaʻina hana o Chip On Board (COB) ka uhi ʻana i ka wahi hoʻonoho wafer silicon me ka epoxy resin thermally conductive (maʻamau ka doped epoxy resin) ma ka ʻili o ka substrate, a laila kau pololei i ka wafer silicon ma ka ʻili o ka substrate, ka mālama ʻana i ka wela a paʻa paʻa ka wafer silika Ma ka substrate. A laila hoʻohana ʻia ka wili uea e hoʻokumu i kahi pilina uila ma waena o ka wafer silika a me ka substrate.

 

Inā makemake ʻoe e ʻike hou aʻe e pili ana i kā mākou huahana, e kipa i kā mākou pūnaewele official:www.deamak.com


Ka manawa hoʻouna: Mei-04-2022